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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Computers and peripherals Thermal Conductive Filler

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Computers and peripherals Thermal Conductive Filler

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Brand Name : AOK

Model Number : TF300

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 400ml(200ml each part)

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)

Product Name : Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste

Thermal conductivity : 3.0（W/m.K）

Viscosity/Component A : 400000 (cps)

Viscosity/Component B : 400000 (cps)

Color : Light Blue

Composition : Ceramic filler + Silicone

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Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

Computers and peripherals Thermal Conductive Filler

TF Series Thermal Conductive Gap Filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses. Graphene reinforced single component precuring heat conducting gel is applied to all kinds of components with low stress
requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers
can automatically dispense glue according to their own process to improve production efficiency.

Product feature


■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications


Product Tags:

Computers Liquid Gap Filling

      

Nontoxic Thermal Conductive Filler

      

thermally conductive Gap Filler

      
Wholesale Computers and peripherals Thermal Conductive Filler from china suppliers

Computers and peripherals Thermal Conductive Filler Images

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